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F1010ES, F1010E Datasheet - Power MOSFET

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F1010ES, F1010E Power MOSFET

PD - 91720 IRF1010ES IRF1010EL l l l l www.DataSheet4U.com l l Advanced Process Technology Surface Mount (IRF1010ES) Low-profile through-hole (IRF10.
Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon.

F1010E_PowerMOSFET.pdf

This datasheet PDF includes multiple part numbers: F1010ES, F1010E. Please refer to the document for exact specifications by model.

Datasheet Details

Part number:

F1010ES, F1010E

Manufacturer:

Power MOSFET

File Size:

161.55 KB

Description:

Power MOSFET

Note:

This datasheet PDF includes multiple part numbers: F1010ES, F1010E.
Please refer to the document for exact specifications by model.

Features

* rrent Body Diode Forward Current di/dt D. U. T. VDS Waveform Diode Recovery dv/dt [VDD] Re-Applied Voltage Inductor Curent Body Diode Forward Drop Ripple ≤ 5% [ ISD ]
* VGS = 5.0V for Logic Level and 3V Drive Devices Fig 14. For N-channel HEXFET® power MOSFETs www. irf. com 7 IRF

Applications

* The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection

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