M6MGB33BS8BWG-P Datasheet - Renesas

M6MGB33BS8BWG-P CMOS SRAM

The M6MGB/T33BS8BWG-P is a Stacked Chip Scale Package (S-CSP) that contents 32M-bit Flash memory and 8M-bit SRAM in a 66-pin Stacked CSP with leaded solder ball. 32M-bit Flash memory is a 2,097,152 words, single power supply and high performance non-volatile memory fabricated by CMOS technology for .

M6MGB33BS8BWG-P Features

* Access Time Flash SRAM 70ns (Max.) 85ns (Max.) F-VCC =VCC=2.7 ~ 3.0V Ta=-40 ~ 85 °C 66 pin S-CSP Ball pitch 0.80mm Outer-ball: Sn - Pb Supply Voltage Ambient Temperature Package Application Mobile communication products PIN CONFIGURATION (TOP VIEW) INDEX(Laser Marking) A B C D E NC NC NC A5 A4

M6MGB33BS8BWG-P Datasheet (97.79 KB)