Datasheet4U.com

TSSOP - Small Outline Packages

Product Overview

📥 Download Datasheet

TSSOP Small Outline Packages by STATS ChipPAC - Datasheet Preview — Datasheet preview – TSSOP

Datasheet Details

Part number	TSSOP
Manufacturer	STATS ChipPAC
File Size	119.46 KB
Description	Small Outline Packages
Datasheet	TSSOP Datasheet
Additional preview pages of the TSSOP datasheet.

Product details

Description

STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.

Features

TSSOP.
Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm.
Lead Count: 8L to 56L.
Lead Pitch: 0.50mm & 0.65mm.
Package Height: 1.20mm max.
JEDEC standard compliant (MO-153).
Lead-free (Pb-free) and Green.
Thermal Enhancements: ep (exposed pad) MSOP.
Body Size: 3 x 3mm.
Lead Count: 8L & 10L.
Lead Pitch: 0.65mm (8L) and 0.50mm (10L).
JEDEC standard compliant.
Lead-free (Pb-free) and Green.
The.

📁 Similar Datasheet

TSSOP-16 - 16-Pin Ceramic Case (RFM)
TSSOP-20 - Mechanical Dimensions (ETC)
TSSOP-8 - Tape and Reel Dimensions (Alpha & Omega Semiconductors)
TSSOP-B14J - IC Packages (Rohm)
TSSOP-B8 - LSI Assembly (Rohm)
TSSOP-B8J - LSI Assembly (Rohm)
TSSOP-C10J - LSI Assembly (Rohm)
TSSOP-C48V - LSI Assembly (Rohm)

Other Datasheets by STATS ChipPAC

Published: Nov 11, 2010 |