TSSOP Datasheet - STATS ChipPAC

TSSOP - Small Outline Packages

STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP. STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile. TSSOP is a leadframe based, plastic encapsulated package with gull wing s.

TSSOP Features

* TSSOP

* Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm

* Lead Count: 8L to 56L

* Lead Pitch: 0.50mm & 0.65mm

* Package Height: 1.20mm max.

* JEDEC standard compliant (MO-153)

* Lead-free (Pb-free) and Green

* Thermal Enhancements: ep (exposed pad) MSOP

TSSOP_STATSChipPAC.pdf