Part number: TSSOP
Manufacturer: STATS ChipPAC
File Size: 119.46KB
Download: 📄 Datasheet
Description: Small Outline Packages
TSSOP
* Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
* Lead Count: 8L to 56L
* Lead Pitch: 0.50mm & 0.65mm
* Package Height: 1.20mm max.
* JEDEC standard co.
requiring a thin profile. TSSOP is a leadframe based, plastic encapsulated package with gull wing shaped leads on two si.
STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP. STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile. TSSOP is a leadframe ba.
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The contents described here.
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LSI Assembly
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DIMENSIONS REF.
A A1 A2 b c www..com D E E1 e K L 0° 0.45 0.60 0.05 0.8 0.19 0.09 4.9 6.2 4.3 5 6.4 4.4 0.65 8° 0.75 0° 0.018 0.024 1
mm M.
