TSSOP Datasheet - STATS ChipPAC

TSSOP, Small Outline Packages

TSSOP and MSOP Small Outline Packages * Wide range of body sizes * 8 to 56 lead counts * Thermally enhanced versions available.
STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.

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Datasheet Details

Part number:

TSSOP

Manufacturer:

STATS ChipPAC

File Size:

119.46 KB

Description:

Small Outline Packages

Features

* TSSOP
* Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
* Lead Count: 8L to 56L
* Lead Pitch: 0.50mm & 0.65mm
* Package Height: 1.20mm max.
* JEDEC standard compliant (MO-153)
* Lead-free (Pb-free) and Green
* Thermal Enhancements: ep (exposed pad) MSOP

Applications

* requiring a thin profile. TSSOP is a leadframe based, plastic encapsulated package with gull wing shaped leads on two sides with lead count ranging from 8 to 56 leads. The ultra thin TSSOP is made possible by optimal wire looping control during the wire bonding process as well as optimal package war

TSSOP Distributors

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TSSOP Small Outline Packages STATS ChipPAC

STATS ChipPAC TSSOP-like datasheet