K4B1G0446C Datasheet (Samsung semiconductor)

K4B1G0446C, 1Gb C-die DDR3 SDRAM

11 5.0 DDR3 SDRAM Addressing 12 6.0 Absolute Maximum Ratings 14 6.1 Absolute Maximum DC Ratings 14 6.2 DRAM Component Operating Temperature Range 14 7.0 AC & DC Operating Conditions 14 7.1 Recommended DC operating Conditions (SSTL_1.5) 14 8.0 AC & DC Input Measurement Levels 15 8.1 AC and DC Logic i

K4B1G04(08/16)46C 1Gb DDR3 SDRAM www.DataSheet4U.com 1Gb C-die DDR3 SDRAM Specification Revision 1.0 June 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

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K4B1G0446C Features

* 4 3.0 Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Packag