K4B1G0446C 1Gb C-die DDR3 SDRAM

Samsung semiconductor

K4B1G0446C Description

K4B1G04(08/16)46C 1Gb DDR3 SDRAM www.DataSheet4U.com 1Gb C-die DDR3 SDRAM Specification Revision 1.0 June 2007 INFORMATION IN THIS DOCUMENT IS PRO.
11 5.

K4B1G0446C Features

* 4 3.0 Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Packag

K4B1G0446C Applications

* where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.

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Datasheet Details

Part number: K4B1G0446C
Manufacturer: Samsung semiconductor
File Size: 1.30 MB
Datasheet: K4B1G0446C_Samsungsemiconductor.pdf
Description: 1Gb C-die DDR3 SDRAM

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1Gb C-die DDR3 SDRAM Samsung semiconductor

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