* 0.03 0.4 0.18 0.07 0.25 C 0.14 0.05 M S A-B C S 0.05 S Solder Plating + 0.09 0.14
* 0.03 + 0.09 0.25
* 0.03 MAX0.02 0.5 ± 0.1 S www.DataSheet4U.com TERMINAL SECTION PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE LQFN-28P-01 LEAD TREATMENT LEAD MATERIAL PA
CXG1190AEQ Datasheet (343.18 KB)
CXG1190AEQ
Sony Corporation
343.18 KB
Gsm/ umt dual mode switch.
GSM ^ UMTS pƒf…Aƒ‹‚ [hAƒ“eiƒXƒCƒb` CXG1190AEQ ŠT v E p“r CXG1190AEQ‚Í C GSM ^ UMTSƒf.
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