VESD05C-FC1 Datasheet - Vishay Siliconix

VESD05C-FC1 Flip Chip Protection Diode

Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic. 1 2 .

VESD05C-FC1 Features

* ESD protection to IEC 61000-4-2 30 kV (air)

* ESD protection to IEC 61000-4-2 8 kV (contact)

* ESD protection to IEC 61000-4-5 (lightning): 8/20 µs, IPPM = 10 mA

* 120 W peak pulse power dissipation per line (8/20 µs)

* Suitable for high frequency applicatio

VESD05C-FC1_VishaySiliconix.pdf