WCMS0808U1X
Weida Semiconductor
259.32kb
32k x 8 static ram. The WCMS0808U1X is composed of a high-performance CMOS static RAM organized as 32K words by 8 bits. Easy memory expansion is provided
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WCMS0808C1X - 32Kx8 Static RAM
(Weida Semiconductor)
S0808C1X
WCMS0808C1X
32Kx8 Static RAM
Features
• Low Voltage Range — 4.5V–5.5V Operation • Low active power — 275 mW (max.) • Low standby power — 28.
WCM-1210HS - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-1210HS-250T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-1210HS-600T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-1210HS-900T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-2012 - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-120T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-121T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-141T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-161T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.