WCMS0808C1X
Weida Semiconductor
257.55kb
32kx8 static ram. The WCMS0808C1X is a high-performance CMOS static RAM organized as 32K words by 8 bits. Easy memory expansion is provided by an activ
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WCMS0808U1X - 32K x 8 Static RAM
(Weida Semiconductor)
S0808U1X
WCMS0808U1X
32K x 8 Static RAM
Features
• Low voltage range: — 2.7V − 3.6V • Low active power and standby power • Easy memory expansion wit.
WCM-1210HS - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-1210HS-250T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-1210HS-600T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-1210HS-900T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM-HS SERIES
FEATURES & APPLICATIONS Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0504 and 0805 .
WCM-2012 - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-120T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-121T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-141T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.
WCM-2012-161T - COMMON MODE CHOKE
(KING CORE)
SPECIFICATION OF WCM SERIES
FEATURES Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI.