AWT6309 Description
Block Diagram AWT6309 Figure 2: Pinout (X-ray Top View) Table 1: Pin Description PIN 1 2 3 4 5 6 7 8 NAME VBATT RFIN VMODE VEN GND GND RFOUT VCC DESCRIPTION Battery Voltage RF Input Mode Control Voltage PA Enable Voltage Ground Ground RF Output Supply Voltage.
AWT6309 Key Features
- InGaP HBT Technology
- High Efficiency: 40 % @ +28 dBm output 22 % @ +17 dBm output
- Low Quiescent Current: 15 mA
- Low Leakage Current in Shutdown Mode: <1 µA
- Internal Voltage Regulation
- Optimized for a 50 Ω System
- Low Profile Miniature Surface Mount Package: 1 mm
- CDMA 1XRTT, 1xEV-DO pliant
- Pinout Enables Easy Phone Board Migration From 4 mm x 4 mm Package
- RoHS-pliant Package, 250 oC MSL-3