ANADIGICS AWT6309
LINEAR POWER AMPLIFIER
FEATURES
● InGaP HBT Technology● High Efficiency: 40 % @ +28 dBm output 22 % @ +17 dBm output
● Low Quiescent Current: 15 mA
● Low Leakage Current in Shutdown Mode: <1 µA
● Internal Voltage Regulation
● Optimized for a 50 Ω System
● Low Profile Miniature Surface Mount Package: 1 mm
● CDMA 1XRTT, 1xEV-DO Compliant
● Pinout Enables Easy Phone Board Migration From 4 mm x 4 mm Package
● RoHS-Compliant Package, 250 oC MSL-3 M9 Package 8 Pin 3 mm x 3 mm x 1 mm Surface Mount Module
APPLICATIONS
● CDMA/EVDO AWS/KPCS band Wireless Handsets and Data Devices The AWT6309 meets the increasing demands for higher efficiency and smaller footprint in CDMA 1X handsets. The package pinout was chosen to enable handset manufacturers to switch from a 4 mm x 4 mm PA module with few layout changes while reducing board area requirements by 44%. The AWT6309 uses ANADIGICS’ exclusive InGaP-Plus™ technology, which combines HBT and pHEMT devices on the same die, to enable state-of-the-art reliability, temperature stability, and ruggedness.