AWT6314R Datasheet | ANADIGICS

FEATURES - - - - - - - - - Single Mode Operation: POUT ≤ +28 d Bm High Efficiency: 54 % AMPS, 39 % CDMA Low Quiescent Current: 50 m A 25 % Package Size Reduction mon VMODE Control Line Simplified VCC Bus PCB routing Reduced External ponent Count Low Profile Surface Mount Package: 1.1 mm Ro HS pliant Package, 250 o C MSL-3 AW T APPLICATIONS - Dual-band Cellular/PCS CDMA Wireless Handsets M23 Package 12 Pin 3 mm x 5 mm x 1 mm Surface Mount Module technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, serve to increase handset talk and standby time. The self contained 3 mm x 5 mm x 1 mm surface mount package incorporates matching networks optimized for output power, efficiency and linearity in a 50 Ω system. GND at slug (pad) PRODUCT DESCRIPTION The AWT6314R meets the increasing demands for higher levels of integration in dual-band CDMA/PCS 1X handsets, while reducing board area requirements by 25 %. The package pinout was chosen to enable handset manufacturers to easily route VCC to both power amplifiers and simplify control with a mon VMODE pin. The device is manufactured on an advanced In Ga P HBT MMIC VREF_PCS 1 Bias Control 12 RFOUT_PCS RFIN_PCS 2 11 GND .. VCC1 3 10 VCC2 VMODE 4 VCC2 A RFIN_CELL 5 Bias Control RFOUT_CELL VREF_CELL 6 Figure 1: Block Diagram 05/2006 GND VREF_PCS RFIN_PCS VCC1 VMODE RFIN_CELL VREF_CELL 1 2 3 4 5 6 GND Figure 2: Pinout 12 11 10 9 8 7 RFOUT_PCS GND VCC2 VCC2A RFOUT_CELL GND Table 1: Pin...