CP323 Description
PROCESS Small Signal Transistor CP323 Central TM NPN - Darlington Transistor Chip Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area .. (631) 435-1824 .centralsemi.
- Part: CP323
- Manufacturer: Central Semiconductor
- Size: 244.57 KB
Related Central Semiconductor Datasheets
| Part Number | Description |
|---|---|
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