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GP1200ESM33 - High Reliability Single Switch IGBT Module Advance Information

Key Features

  • s s s High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN Substrates KEY.

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Datasheet Details

Part number GP1200ESM33
Manufacturer Dynex Semiconductor
File Size 150.49 KB
Description High Reliability Single Switch IGBT Module Advance Information
Datasheet download datasheet GP1200ESM33 Datasheet

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GP1200ESM33 GP1200ESM33 High Reliability Single Switch IGBT Module Advance Information Replaces July 2000 version, DS5308-1.6 DS5308-2.1 February 2001 FEATURES s s s High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES (typ) VCE(sat) (max) IC (max) IC(PK) 3300V 3.4V 1200A 2400A APPLICATIONS s s s s High Reliability Inverters C1 Motor Controllers Traction Drives Resonant Converters Aux C External connection C2 C3 The Powerline range of high power modules includes dual and single switch configurations covering voltages from 1200V to 3300V and currents up to 4800A. The GP1200ESM33 is a single switch 3300V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module.