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FDZ204P Datasheet P-channel 2.5v Specified Powertrench

Manufacturer: Fairchild (now onsemi)

Overview: FDZ204P March 2003 FDZ204P P-Channel 2.5V Specified PowerTrench   BGA.

General Description

bining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS(ON).

This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).

Applications • Battery management • Load switch • Battery protection D D S S D P in 1 S F204P S G S S G Bottom Top TA=25oC unless otherwise noted D Absolute Maximum Ratings VDSS VGSS ID Symbol PD TJ, TSTG Drain-Source Voltage Gate-Source Voltage Drain Current – Continuous (Note 1a) – Pulsed Power Dissipation (Steady State) (Note 1a) Operating and Storage Junction Temperature Range Parameter –20 ±12 –4.5 –20 1.8 –55 to +150 Ratings Units V V A W °C Thermal Characteristics RθJA RθJB RθJC Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ball Thermal Resistance, Junction-to-Case (Note 1a) (Note 1) (Note 1) 67 11 1 °C/W °C/W °C/W Package Marking and Ordering Information Device Marking 204P Device FDZ204P Reel Size 7’’ Tape width 8mm Quantity 3000 units ©2003 Fairchild Semiconductor Corporation FDZ204P Rev.

Key Features

  • 4.5 A,.
  • 20 V. RDS(ON) = 45 mΩ @ VGS =.
  • 4.5 V RDS(ON) = 75 mΩ @ VGS =.
  • 2.5 V.
  • Occupies only 4 mm2 of PCB area. Less than 40% of the area of a SSOT-6.
  • Ultra-thin package: less than 0.80 mm height when mounted to PCB.
  • Ultra-low Qg x RDS(ON) figure-of-merit.
  • High power and current handling capability. General.

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FDZ204P Distributor