FDZ206P Description
bining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).
FDZ206P Key Features
- 13 A, -20 V. RDS(ON) = 9.5 mΩ @ VGS = -4.5 V RDS(ON) = 14.5 mΩ @ VGS = -2.5 V
- Occupies only 14 mm2 of PCB area. Only 42% of the area of SO-8
- Ultra-thin package: less than 0.80 mm height when mounted to PCB
- 0.65 mm ball pitch
- 3.5 x 4 mm2 footprint
- High power and current handling capability