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FDZ206P Datasheet P-channel 2.5v Specified Powertrench

Manufacturer: Fairchild (now onsemi)

Overview: FDZ206P January 2003 FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET  .

General Description

bining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS(ON).

This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).

Key Features

  • 13 A,.
  • 20 V. RDS(ON) = 9.5 mΩ @ VGS =.
  • 4.5 V RDS(ON) = 14.5 mΩ @ VGS =.
  • 2.5 V.
  • Occupies only 14 mm2 of PCB area. Only 42% of the area of SO-8.
  • Ultra-thin package: less than 0.80 mm height when mounted to PCB.
  • 0.65 mm ball pitch.
  • 3.5 x 4 mm2 footprint.
  • High power and current handling capability.

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FDZ206P Distributor