GFD2206 Description
0.009 (0.23) 0.001 (0.03) Dimensions in inches and (millimeters) 0.243 (6.172) 0.063 (1.6) Mounting Pad Layout Case: JEDEC TO-252 molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 High temperature soldering guaranteed:.
GFD2206 Key Features
- Advanced Trench Process Technology
- High Density Cell Design for Ultra Low On-Resistance
- Rugged-Avalanche Energy Rated
- Fast Switching for High Efficiency
- 55 to 150 2 40
- 22 25 4.0
- 35 160 120 90
- Qg Qgs Qgd td(on) tr
- 36 65 15 17 20 107 92 56 3425 320 162