GFD50N03 Description
0.009 (0.23) 0.001 (0.03) Dimensions in inches and (millimeters) 0.243 (6.172) 0.063 (1.6) Mounting Pad Layout Case: JEDEC TO-252 molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 High temperature soldering guaranteed:.
GFD50N03 Key Features
- Advanced Trench Process Technology
- High Density Cell Design for Ultra Low On-Resistance
- Specially Designed for Low Voltage DC/DC Converters and motor drives
- Fast Switching for High Efficiency
- 7.1 10 50
- 3.0 ±100 1.0
- V V nA µA A mΩ S
- 26 29 132 57
- pF ns nC
- IS VSD