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IS43R16400B - Four internal banks for concurrent operation

General Description

A0-A11 A0-A7 BA0, BA1 DQ0 DQ15 CK, CK CKE CS CAS RAS Row Address Input Column Address Input Bank Select Address Data I/O System Clock Input Clock Enable Chip Select Column Address Strobe Command Row Address Strobe Command WE LDM, UDM LDQS, UDQS VDD VDDQ VSS VSSQ VREF NC Write Enable Data

Key Features

  • VDD and VDDQ: 2.5V ± 0.2V (-5, -6) VDD and VDDQ: 2.6V ± 0.1V (-4) SSTL_2 compatible I/O Double-data rate architecture; two data transfers per clock cycle Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver DQS is edge-aligned with data for READs and centre-aligned with data for WRITEs Differential clock inputs (CK and CK) DLL aligns DQ and DQS transitions with CK transitions Comma.

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The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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IS43R16400B 4Mx16 64Mb DDR SDRAM FEATURES • • • • • VDD and VDDQ: 2.5V ± 0.2V (-5, -6) VDD and VDDQ: 2.6V ± 0.1V (-4) SSTL_2 compatible I/O Double-data rate architecture; two data transfers per clock cycle Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver DQS is edge-aligned with data for READs and centre-aligned with data for WRITEs Differential clock inputs (CK and CK) DLL aligns DQ and DQS transitions with CK transitions Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS Four internal banks for concurrent operation Data Mask for write data.