Datasheet4U Logo Datasheet4U.com

IXGK50N60AU1 - HiPerFAST IGBT

Key Features

  • W °C °C °C l l l l Mounting torque (M4) 0.9/6 Nm/lb. in. 10 300 g °C l l Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s International standard package JEDEC TO-264 AA High frequency IGBT and antiparallel FRED in one package 2nd generation.

📥 Download Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
HiPerFASTTM IGBT with Diode www.datasheet4u.com IXGK 50N60AU1 Combi Pack VCES IC25 VCE(sat) tfi = = = = 600 V 75 A 2.7 V 275 ns Symbol VCES VCGR VGES VGEM I C25 I C90 I CM SSOA (RBSOA) PC TJ TJM Tstg Md Weight Test Conditions TJ = 25 °C to 150°C TJ = 25 °C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25 °C, limited by leads TC = 90 °C TC = 25 °C, 1 ms VGE = 15 V, T VJ = 125°C, RG = 10 Ω Clamped inductive load, L = 30 µH TC = 25 °C Maximum Ratings 600 600 ±20 ±30 75 50 200 ICM = 100 @ 0.8 VCES 300 -55 ... +150 150 -55 ... +150 V V V V A A A A TO-264 AA G C E C = Collector, TAB = Collector G = Gate, E = Emitter, Features W °C °C °C l l l l Mounting torque (M4) 0.9/6 Nm/lb.in. 10 300 g °C l l Maximum lead temperature for soldering 1.6 mm (0.062 in.