IXSK50N60BU1 Description
+150 V V V V A A A A ms W °C °C °C Nm/lb.in. g °C G C E TO-264 AA (IXSK) G C E C = Collector, TAB = Collector G = Gate, E = Emitter, Mounting torque 0.9/6 10 300 Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10.
IXSK50N60BU1 Key Features
- International standard package JEDEC TO-264 AA, and hole-less TO-247 package for clip mounting
- Guaranteed Short Circuit SOA capability
- High frequency IGBT and antiparallel FRED in one package
- Latest generation HDMOSTM process
- Low VCE(sat)
- for minimum on-state conduction losses
- MOS Gate turn-on
- drive simplicity
- Fast Recovery Epitaxial Diode (FRED)
- soft recovery with low IRM