IXTL2N450 Description
+150 A A W C C C Maximum Lead Temperature for Soldering Plastic Body for 10s 300 °C 260 °C Mounting Force 20..120 / 4.5..27 N/lb. 3.5 6.0 V 200 nA 10 A 50 μA 250 μA 20 G S D G = Gate D = Drain Isolated Tab S = Source.
IXTL2N450 Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Mounting Surface
- 4000V~ RMS Electrical Isolation
- Molding Epoxies meet UL 94 V-0
- Easy to Mount
- Space Savings
- High Power Density