IRF6614TRPBF Description
The IRF6614PbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infrared or convection soldering techniques, when...
IRF6614TRPBF Key Features
- Application Specific MOSFETs
- Ideal for CPU Core DC-DC Converters
- Low Conduction Losses and Switching Losses
- Low Profile (<0.7mm)
- Dual Sided Cooling patible
- patible with existing Surface Mount Techniques