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IRF6623TRPBF - HEXFET Power MOSFET

General Description

The IRF6623PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile.

Key Features

  • d(off) tf Fig 15a. Switching Time Test Circuit Fig 15b. Switching Time Waveforms Id Vds Vgs L 0 DUT 1K VCC Vgs(th) Qgs1 Qgs2 Qgd Qgodr Fig 16a. Gate Charge Test Circuit Fig 16b. Gate Charge Waveform www. irf. com 5 IRF6623PbF D. U. T Driver Gate Drive + P. W. Period D= P. W. Period VGS=10V.
  • - www. datasheet4u. com + Circuit Layout Considerations.
  • Low Stray Inductance.
  • Ground Plane.
  • Low Leakage Inductance Current Transformer.
  • D. U. T. ISD Waveform.

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Other Datasheets by International Rectifier (now Infineon)

Part Number Description
IRF6623 HEXFET Power MOSFET
IRF6623PBF HEXFET Power MOSFET
IRF6620 HEXFETPower MOSFET
IRF6620PBF Power MOSFET
IRF6620TRPBF Power MOSFET
IRF6621 Power MOSFET
IRF6621PbF Power MOSFET
IRF6621TRPbF Power MOSFET
IRF6622 DirectFET Power MOSFET
IRF6622PBF DirectFET Power MOSFET

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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PD - 97085 IRF6623PbF IRF6623TRPbF RoHS Compliant ‰ Lead-Free (Qualified up to 260°C Reflow) l Application Specific MOSFETs www.datasheet4u.com l Ideal for CPU Core DC-DC Converters l Low Conduction Losses l High Cdv/dt Immunity l Low Profile (<0.7mm) l Dual Sided Cooling Compatible ‰ l Compatible with existing Surface Mount Techniques ‰ l l DirectFET™ Power MOSFET Š VDSS 20V RDS(on) max 5.7mΩ@VGS = 10V 9.7mΩ@VGS = 4.5V Qg(typ.) 11nC ST Applicable DirectFET Outline and Substrate Outline (see p.8,9 for details) SQ SX ST MQ MX MT DirectFET™ ISOMETRIC Description The IRF6623PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.