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IRF6674TRPBF Datasheet Power MOSFET

Manufacturer: International Rectifier (now Infineon)

Overview: PD - 97133 IRF6674TRPbF DirectFET™ Power MOSFET ‚ Typical values (unless otherwise specified) RoHS pliant  l Lead-Free (Qualified up to 260°C Reflow) l Application Specific MOSFETs l Ideal for High Performance Isolated Converter Primary Switch Socket l Optimized for Synchronous Rectification l Low Conduction Losses l High Cdv/dt Immunity l Dual Sided Cooling patible  l patible with existing Surface Mount Techniques  l VDSS Qg tot VGS Qgd 8.3nC RDS(on) 9.0mΩ@ 10V 60V max ±20V max 24nC Vgs(th) 4.0V MZ Applicable DirectFET Outline and Substrate Outline (see p.

General Description

The IRF6674PbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an Micro8 and only 0.7 mm profile.

The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes.

The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

Key Features

  • rce Voltage (V) Fig 10. Typical Source-Drain Diode Forward Voltage 14 12 5.0 Fig11. Maximum Safe Operating Area VGS(th) Gate threshold Voltage (V) 4.5 ID , Drain Current (A) 10 8 6 4 2 0 25 50 75 100 125 150 4.0 3.5 ID = 250μA ID = 100μA 3.0 2.5 2.0 -75 -50 -25 0 25 50 75 100 125 150 TJ , Ambient Temperature (°C) TJ , Temperature ( °C ) Fig 12. Maximum Drain Current vs. Ambient Temperature 400 Fig 13. Typical Threshold Voltage vs. Junction Temperature ID 4.5A 9.3A BOTTOM 26.8A TO.

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