IRF6691 Description
The IRF6691 bines IRs industry leading DirectFET package technology with the latest monolithic die technology, which integrates MOSFET plus free-wheeling Schottky diode. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing...
IRF6691 Key Features
- Ideal for CPU Core DC-DC Converters
- Low Conduction Losses
- Low Reverse Recovery Losses
- Low Switching Losses
- Low Reverse Recovery Charge and Low Vf
- Low Profile (<0.7 mm)
- Dual Sided Cooling patible
- patible with existing Surface Mount Techniques