IRF6728MPBF Description
The IRF6728MPbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application...
IRF6728MPBF Key Features
- RoHS pliant Containing No Lead and Halogen Free
- IRF6728MPbF IRF6728MTRPbF V R R Typical values (unless otherwise specified) DSS GS DS(on) DS(on) Integrat
- Low Profile (<0.7 mm) Qg tot Qgd Qgs2 Qrr Qoss Vgs(th)
- Dual Sided Cooling patible
- Ultra Low Package Inductance 28nC 8.7nC 3.1nC 29nC 22nC 1.8V
- Optimized for High Frequency Switching
- Ideal for CPU Core DC-DC Converters S
- Optimized for Sync. FET socket of Sync. Buck Converter G D D