IRF6802SDPBF Overview
The IRF6802SDTRPbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging to achieve improved performance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET® package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application...
IRF6802SDPBF Key Features
- Dual Sided Cooling patible
- Low Package Inductance Qg tot Qgd Qgs2 Qrr Qoss Vgs(th)
- Ideal for CPU Core DC-DC Converters
- Optimized for Control FET socket of Sync. Buck Converter
- Low Conduction and Switching Losses G G D D
- patible with existing Surface Mount Techniques S S
- 100% Rg tested