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IRF8327SPBF - Power MOSFET

General Description

The IRF8327SPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile.

Key Features

  • 1 VGS = 0V 0 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 VSD, Source-to-Drain Voltage (V) Fig 10. Typical Source-Drain Diode Forward Voltage 60 50 40 30 20 10 0 25 50 75 100 125 150 TC , Case Temperature (°C) Fig 12. Maximum Drain Current vs. Case Temperature 250 200 150 Typical VGS(th) Gate threshold Voltage (V) ID, Drain-to-Source Current (A) 1000 100.

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IRF8327SPbF l RoHS Compliant and Halogen Free  l Low Profile (<0.7 mm) l Dual Sided Cooling Compatible  l Ultra Low Package Inductance l Optimized for High Frequency Switching  l Ideal for CPU Core DC-DC Converters l Optimized for Control FET application l Low Conduction and Switching Losses l Compatible with existing Surface Mount Techniques  l 100% Rg tested DirectFET® Power MOSFET ‚ Typical values (unless otherwise specified) VDSS VGS RDS(on) RDS(on) 30V max ±20V max 5.1mΩ@ 10V 8.5mΩ@ 4.5V Qg tot Qgd Qgs2 Qrr Qoss Vgs(th) 9.2nC 3.0nC 1.2nC 19nC 7.9nC 1.9V SQ DirectFET® ISOMETRIC Applicable DirectFET Outline and Substrate Outline (see p.