HSC276 Datasheet | Kexin Semiconductor

Features High forward current, Low capacitance. Ultra small Flat Package (UFP) is suitable for surface mount design. +0.05 0.8 -0.05 SOD-523 1.2+0.1 -0.1 + +0.05 0.3 -0.05 Unit: mm 0.6+0.1 -0.1 - 1.6+0.1 -0.1 0.77max +0.05 0.1 -0.02 0.07max A bsolute M axim um R atings T a = 25 P aram eter R everse V oltage A verage rectified current Junction tem perature S torage tem perature Sym bol VR IO Tj T stg V alue 3 30 125 -55 to +125 U nit V m A Electrical Characteristics Ta = 25 Parameter Symbol Conditions M in Reverse voltage IR = 10 A Reverse current VR = 0.5 V Forward voltage VR = 0.5 V Capacitance VR = 0.5 V, f = 1 MHz ESD-Capability (Note 1) C=200p F , Both forward and 30 reverse direction 1...