Datasheet Summary
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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TMOS E-FET.™ Power Field Effect Transistor D3PAK for Surface Mount
The D3PAK package has the capability of housing the largest chip size of any standard, plastic, surface mount power semiconductor. This allows it to be used in applications that require surface mount ponents with higher power and lower RDS(on) capabilities. This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltage- blocking capability without degrading performance over time. In addition, this advanced TMOS E- FET is designed to withstand high energy in the avalanche and mutation modes. The new...