Datasheet4U Logo Datasheet4U.com

BC69PAS - 2A PNP medium power transistors

General Description

PNP medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

Key Features

  • High collector current capability.
  • Three current gain selections IC and ICM.
  • Reduced Printed-Circuit Board (PCB).
  • Leadless very small SMD plastic area requirements package with medium power capability.
  • Exposed heat sink for excellent thermal.
  • Suitable for Automatic Optical and electrical conductivity Inspection (AOI) of solder joint.
  • AEC-Q101 qualified 1.3.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
BC69PA 2A PNP medium power transistors nexperia
BC6130 Fully Qualified Single-chip Bluetooth-v2.1+EDR CSR
BC6140 Fully Qualified Single-chip Bluetooth v2.1 + EDR System CSR
BC6145 Fully Qualified Single-chip Bluetooth v3.0 System CSR
BC617 NPN Silicon Darlington Transistors Siemens Semiconductor Group

Other Datasheets by NXP Semiconductors

Part Number Description
BC69PA PNP medium power transistors
BC618 NPN Darlington transistor
BC635 NPN medium power transistors
BC636 PNP medium power transistors
BC637 NPN medium power transistors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
')1' BC69PAS series 20 V, 2 A PNP medium power transistors Rev. 1 — 19 June 2015 Product data sheet 1. Product profile 1.1 General description PNP medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads. NPN complement: BC68PAS series 1.2 Features and benefits  High collector current capability  Three current gain selections IC and ICM  Reduced Printed-Circuit Board (PCB)  Leadless very small SMD plastic area requirements package with medium power capability  Exposed heat sink for excellent thermal  Suitable for Automatic Optical and electrical conductivity Inspection (AOI) of solder joint  AEC-Q101 qualified 1.