BY578 Datasheet | NXP Semiconductors

FEATURES - Glass passivated - High maximum operating temperature - Low leakage current - Excellent stability - Also available with preformed leads for easy insertion - Designed to withstand transients up to 1700 V. APPLICATIONS - For use in multi-sync monitor horizontal deflection circuits handbook, halfpage BY558; BY578 DESCRIPTION Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. k a MAM384 Fig.1 Simplified outline (SOD115) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM BY558 BY578 VRRM repetitive peak reverse voltage BY558 BY578 VR IF(AV) continuous reverse voltage average forward current Ttp = 65 °C; see Fig.2; PCB mounting; averaged over any 20 ms period; see Fig.4 t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax - - - - 1500 1700 1400 V V V PARAMETER non-repetitive peak reverse voltage - - 1500 1700 V V CONDITIONS MIN. MAX. UNIT 2.5 A IFRM IFSM repetitive peak forward current non-repetitive peak forward current - - 12 80 Tstg Tj storage temperature junction temperature - 65 - 65 +175 +150 °C °C 1998 Jun 25 Philips Semiconductors Product specification Damper diodes ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL VF IR trr PARAMETER forward voltage reverse current reverse recovery time CONDITIONS IF = 5 A; Tj = Tj max; see Fig.3 IF = 5 A; see Fig.3 VR = VRRMmax; Tj = 150 °C when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig.6 IF = 5 A; d IF/dt = 50 A/µs; see Fig.5 IF = 5 A; d IF/dt = 50 A/µs; VF = 5 V; see Fig.5 IF = 5 A; d IF/dt = 50 A/µs; VF = 2 V; see Fig.5 THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS lead length = 10 mm BY558; BY578 TYP. - - - - MAX. 1.3 V...