Datasheet4U Logo Datasheet4U.com

PHN203 - Dual N-channel enhancement mode TrenchMOS transistor

Datasheet Summary

Description

N-channel enhancement mode field-effect power transistor in a plastic envelope using ’trench’ technology.

The device has very low on-state resistance.

It is intended for use in dc to dc converters and general purpose switching applications.

Features

  • Dual device.
  • Low threshold voltage.
  • Fast switching.
  • Logic level compatible.
  • Surface mount package PHN203 SYMBOL d1 d1 d2 d2 QUICK.

📥 Download Datasheet

Datasheet preview – PHN203

Datasheet Details

Part number PHN203
Manufacturer NXP
File Size 98.60 KB
Description Dual N-channel enhancement mode TrenchMOS transistor
Datasheet download datasheet PHN203 Datasheet
Additional preview pages of the PHN203 datasheet.

📁 Similar Datasheet

Other Datasheets by NXP
  • PHN205 - Dual N-channel enhancement mode MOS transistor
  • PHN210 - Dual N-channel enhancement mode TrenchMOS transistor
  • PHN210T - Dual N-channel TrenchMOS intermediate level FET
  • PHN1011 - TrenchMOS transistor Logic level FET
  • PHN1013 - N-channel enhancement mode MOS transistor
  • PHN1015 - N-channel TrenchMOS transistor Logic level
  • PHN1018 - N-channel TrenchMOS transistor Logic level FET
  • PHN103 - N-channel enhancement mode MOS transistor

Full PDF Text Transcription

Click to expand full text
Philips Semiconductors Product specification Dual N-channel enhancement mode TrenchMOSTM transistor FEATURES • Dual device • Low threshold voltage • Fast switching • Logic level compatible • Surface mount package PHN203 SYMBOL d1 d1 d2 d2 QUICK REFERENCE DATA VDS = 25 V ID = 6.3 A RDS(ON) ≤ 30 mΩ (VGS = 10 V) RDS(ON) ≤ 55 mΩ (VGS = 4.5 V) s1 g1 s2 g2 GENERAL DESCRIPTION N-channel enhancement mode field-effect power transistor in a plastic envelope using ’trench’ technology. The device has very low on-state resistance. It is intended for use in dc to dc converters and general purpose switching applications. The PHN203 is supplied in the SOT96-1 (SO8) surface mounting package.
Published: |