SOT527-1 datasheet by NXP Semiconductors.
| Part number | SOT527-1 |
|---|---|
| Datasheet | SOT527-1_PhilipsSemiconductors.pdf |
| File Size | 12.28 KB |
| Manufacturer | NXP Semiconductors |
| Description | Package outline |
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2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; Plastic or metal protrusions of 0.15 mm maximum per side are not included.
View all NXP Semiconductors datasheets
| Part Number | Description |
|---|---|
| SOT545-3 | plastic thermal enganced thin quad flat package |
| SOT1061 | plastic thermal enhanced ultra thin small outline package |
| SOT109-1 | Package outline |
| SOT1699-1 | low profile quad flat package |
| SOT263 | Package outline |
| SOT27-1 | Package outline |
| SOT313-2 | LQFP48 Reel pack Packing information |
| SOT314-2 | Packing information |
| SOT353 | plastic surface-mounted package |
| SOT363 | Plastic surface-mounted package |
