SOT527-1 Description
2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; Plastic or metal protrusions of 0.15 mm maximum per side are not included.
- Part: SOT527-1
- Manufacturer: NXP Semiconductors (official site)
- Size: 12.28 KB
Related NXP Semiconductors Datasheets
| Part Number | Description |
|---|---|
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