Datasheet Details
| Part number | SOT545-3 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 74.21 KB |
| Description | plastic thermal enganced thin quad flat package |
| Datasheet | SOT545-3_PhilipsSemiconductors.pdf |
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Overview: ( DataSheet : .. ) PDF: 2004 Feb 05 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed.
| Part number | SOT545-3 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 74.21 KB |
| Description | plastic thermal enganced thin quad flat package |
| Datasheet | SOT545-3_PhilipsSemiconductors.pdf |
|
|
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| Part Number | Description |
|---|---|
| SOT527-1 | Package outline |
| SOT1061 | plastic thermal enhanced ultra thin small outline package |
| SOT109-1 | Package outline |
| SOT1699-1 | low profile quad flat package |
| SOT263 | Package outline |
| SOT27-1 | Package outline |
| SOT313-2 | LQFP48 Reel pack Packing information |
| SOT314-2 | Packing information |
| SOT353 | plastic surface-mounted package |
| SOT363 | Plastic surface-mounted package |