SOT545-3 Description
2004 Feb 05 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; Plastic or metal protrusions of 0.25 mm maximum per side are not included.
- Part: SOT545-3
- Manufacturer: NXP Semiconductors (official site)
- Size: 74.21 KB
Related NXP Semiconductors Datasheets
| Part Number | Description |
|---|---|
| SOT527-1 | Package outline |
| SOT1061 | plastic thermal enhanced ultra thin small outline package |
| SOT109-1 | Package outline |
| SOT1699-1 | low profile quad flat package |
| SOT263 | Package outline |