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GaAlAs Infrared Emitting Diodes
Molded Lateral Package — 880 nm
VTE7172, 7173
PACKAGE DIMENSIONS inch (mm)
DESCRIPTION
CASE 7 LATERAL CHIP SIZE: .011" x .011"
These side-looking packages are designed for use in PC board mounted interrupt detectors. The package is transfer molded plastic and contains a high efficiency, 880 nm, GaAlAs IRED die.
ABSOLUTE MAXIMUM RATINGS @ 25°C (unless otherwise noted)
Maximum Temperatures Storage and Operating: Continuous Power Dissipation: Derate above 30°C: Maximum Continuous Current: Derate above 30°C: Peak Forward Current, 10 µs, 100 pps: Temp. Coefficient of Power Output (Typ.): -40°C to 85°C 100 mW 1.82 mW/°C 50 mA 0.91 mA/°C 2.5 A -.
VTE7173 Datasheet
