SAA4998H Datasheet | Philips Semiconductors

FEATURES 2 GENERAL DESCRIPTION 2.1 Patent notice 2.2 Latch-up test 3 QUICK REFERENCE DATA 4 ORDERING INFORMATION 5 BLOCK DIAGRAMS 6 PINNING 7 CONTROL REGISTER DESCRIPTION 8 LIMITING VALUES 9 THERMAL CHARACTERISTICS 10 11 12 12.1 12.2 12.3 12.4 12.5 12.6 13 14 15 Product specification CHARACTERISTICS PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods Additional soldering information DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2004 Feb 18 Downloaded from Arrow.. Philips Semiconductors Field and line rate converter with noise reduction and...