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RJH30H2DPK-M0 - High Speed Power Switching

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Description

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Features

  • Trench gate and thin wafer technology (G6H-II series) Low collector to emitter saturation voltage: VCE(sat) = 1.4 V typ High speed switching: tr = 100 ns typ, tf = 180 ns typ Low leak current: ICES = 1 A max Built-in Fast Recovery Diode: VF = 1.4 V typ , trr = 23 ns typ R07DS0464EJ0200 Rev.2.00 Jun 15, 2011 Outline.

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Datasheet Details

Part number RJH30H2DPK-M0
Manufacturer Renesas
File Size 212.20 KB
Description High Speed Power Switching
Datasheet download datasheet RJH30H2DPK-M0 Datasheet
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Full PDF Text Transcription

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Preliminary Datasheet RJH30H2DPK-M0 Silicon N Channel IGBT High speed power switching Features      Trench gate and thin wafer technology (G6H-II series) Low collector to emitter saturation voltage: VCE(sat) = 1.4 V typ High speed switching: tr = 100 ns typ, tf = 180 ns typ Low leak current: ICES = 1 A max Built-in Fast Recovery Diode: VF = 1.4 V typ , trr = 23 ns typ R07DS0464EJ0200 Rev.2.00 Jun 15, 2011 Outline RENESAS Package code: PRSS0004ZH-A (Package name: TO-3PSG) C 4 G 1. Gate 2. Collector 3. Emitter 4. Collector (Flange) E 1 2 3 www.DataSheet.
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