SSD2805 Datasheet | SOLOMON

DESCRIPTION The SSD2805 IC is a MIPI master bridge chip that connects a host processor with traditional parallel LCD interface and an LCD driver with MIPI slave interface. The SSD2805 supports parallel RGB and MCU interface and serial SPI interface. 2 FEATURES - Support up to 700Mbps over 2 data lanes (350Mbps per lane) - Reduce number of signals to 8 lines over the serial link (DATAP0, DATAN0, DATAP1, DATAN1, CLKP, CLKN, MIPI_RES# and SYS_CLK) - Reduce power consumption and decrease EMI by using low amplitude signal over differential pair for serial data. - Support parallel MCU interface up to 16 bits (6800, 8080) - Support parallel RGB interface up to 24 bits - Support serial SPI interface up to 24 bits (8 Bit 4 Wire, 8 Bit 3 Wire, 24 Bit 3 Wire) - Support 16, 18 and 24 bit per pixel for both MCU and RGB interfaces - Support dual display panel (MCU + MCU panels or MCU + RGB panels) - Support both mand mode and video mode in MIPI DSI standard - Support bi-directional data transfer (forward link in High Speed and Low Power mode and reverse link in Low Power mode) - Ultra Low Power mode in idle state - On-chip PLL with programmable output frequency - Power supply: (VDDD and VDDA) 1.8V +/-10% - IO Power supply: (VDDIO) 3.3V +/-10%, 1.8V +/-10% - Support of MIPI standard DSI v1.01r9, D-PHY v0.89 - 8KV (HBM) ESD protection on MIPI lanes Rev 1.1 P 7/38 Apr 2011 Solomon Systech 3 ORDERING INFORMATION Ordering Part Number SSD2805CG39 SSD2805CG39R SSD2805DG39 SSD2805DG39R SSD2805G39 SSD2805AG39 SSD2805BG39 Table 3-1: Ordering Information Package Form 64 TFBGA (Ro HS Package in Tray form) 64 TFBGA (Ro HS Package in Tape & Reel form) 64 TFBGA (Ro HS + Halogen free Package in Tray form) 64 TFBGA (Ro HS + Halogen free Package in Tape & Reel form) 64 TFBGA (Ro HS Package in Tray form) 64 TFBGA (Ro HS Package in Tray form) 64 TFBGA (Ro HS Package in Tray form) Remark EOL EOL EOL Rev 1.1 P 8/38 Apr 2011 Solomon Systech 4 BLOCK DIAGRAM Clock and Reset module...