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STGW100H65FB2-4 - IGBT

General Description

The newest IGBT 650 V HB2 series represents an evolution of the advanced proprietary trench gate field-stop structure.

The performance of the HB2 series is optimized in terms of conduction, thanks to a better VCE(sat) behavior at low current values, as well as in terms of reduced switching energy.

Key Features

  • Maximum junction temperature: TJ = 175 °C.
  • Low VCE(sat) = 1.55 V (typ. ) @ IC = 100 A.
  • Minimized tail current.
  • Tight parameter distribution.
  • Low thermal resistance.
  • Positive VCE(sat) temperature coefficient.
  • Excellent switching performance thanks to the extra driving kelvin pin.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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STGW100H65FB2-4 Datasheet Trench gate field-stop, 650 V, 100 A, high-speed HB2 series IGBT in a TO247-4 package TO247-4 2 34 1 C(1,TAB) G(4) K(3) Features • Maximum junction temperature: TJ = 175 °C • Low VCE(sat) = 1.55 V (typ.) @ IC = 100 A • Minimized tail current • Tight parameter distribution • Low thermal resistance • Positive VCE(sat) temperature coefficient • Excellent switching performance thanks to the extra driving kelvin pin Applications • Welding • Power factor correction • UPS • Solar inverters • Chargers E(2) NG4K3E2C1TAB_no_diode Description The newest IGBT 650 V HB2 series represents an evolution of the advanced proprietary trench gate field-stop structure.