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MMBT2907A - PNP Transistor

Key Features

  • ◇ Epitaxial planar die construction ◇ Surface device type mounting ◇ Moisture sensitivity level 1 ◇ Matte Tin(Sn) lead finish with Nickel(Ni) underplate ◇ Pb free version and RoHS compliant ◇ Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code Mechanical Data ◇ Case : SOT- 23 small outline plastic package ◇ Terminal : Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed ◇ High temperature soldering guaranteed : 260°C/10s ◇ Weight :.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Small Signal Product Features ◇ Epitaxial planar die construction ◇ Surface device type mounting ◇ Moisture sensitivity level 1 ◇ Matte Tin(Sn) lead finish with Nickel(Ni) underplate ◇ Pb free version and RoHS compliant ◇ Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code Mechanical Data ◇ Case : SOT- 23 small outline plastic package ◇ Terminal : Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed ◇ High temperature soldering guaranteed : 260°C/10s ◇ Weight : 0.008 grams (approximately) ◇ Marking Code : 2F Maximum Ratings and Electrical Characteristics Rating at 25°C ambient temperature unless otherwise specified.