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THGBM4G5D1HBAIR - 4GB e-MMC Module

Key Features

  • THGBM4G5D1HBAIR Interface THGBM4G5D1HBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Ball / Signal Allocation P-VFBGA153-1113-0.50-002 (11.5 x 13mm, H1.0mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC RFU RFU RFU Vss Vcc RFU NC NC RFU 9 NC NC NC RFU Vcc NC NC NC 8 NC NC NC 7 RFU NC NC RFU Vss Top Vi.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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THGBM4G5D1HBAIR TOSHIBA e-MMC Module 4GB THGBM4G5D1HBAIR INTRODUCTION THGBM4G5D1HBAIR is 4-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module. THGBM4G5D1HBAIR has an industry standard MMC protocol for easy use. FEATURES THGBM4G5D1HBAIR Interface THGBM4G5D1HBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Ball / Signal Allocation P-VFBGA153-1113-0.50-002 (11.5 x 13mm, H1.0mm max.