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THGBM4G6D2HBAIR - 8GB e-MMC Module

Key Features

  • THGBM4G6D2HBAIR Interface THGBM4G6D2HBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Ball / Signal Allocation P-VFBGA153-1113-0.50-002FP(A) (11.5 x 13mm, H1.0mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC RFU RFU RFU Vss Vcc RFU NC NC RFU 9 NC NC NC RFU Vcc NC NC NC 8 NC NC NC 7 RFU NC NC RFU Vss T.

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Full PDF Text Transcription (Reference)

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Preliminary THGBM4G6D2HBAIR 8GB THGBM4G6D2HBAIR TOSHIBA e-MMC Module INTRODUCTION THGBM4G6D2HBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module. THGBM4G6D2HBAIR has an industry standard MMC protocol for easy use. FEATURES THGBM4G6D2HBAIR Interface THGBM4G6D2HBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Ball / Signal Allocation P-VFBGA153-1113-0.50-002FP(A) (11.5 x 13mm, H1.0mm max.