THGBM4G6D2HBAIR
THGBM4G6D2HBAIR is 8GB e-MMC Module manufactured by Toshiba.
Preliminary THGBM4G6D2HBAIR
8GB THGBM4G6D2HBAIR
TOSHIBA e-MMC Module
INTRODUCTION
THGBM4G6D2HBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module. THGBM4G6D2HBAIR has an industry standard MMC protocol for easy use.
Features
THGBM4G6D2HBAIR Interface
THGBM4G6D2HBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Ball / Signal Allocation
P-VFBGA153-1113-0.50-002FP(A) (11.5 x 13mm, H1.0mm max. package)
14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
11 NC NC NC
NC NC NC
10 NC NC NC
RFU RFU RFU Vss Vcc RFU
NC NC RFU
9 NC NC NC
Vcc NC NC NC
8 NC NC NC 7 RFU NC NC
Vss
Top View
Vss RFU
NC NC NC NC NC RFU
6 RFU DAT7 Vcc Q
Vcc
CLK NC Vss Q
5 DAT2 DAT6 RFU
RFU Vcc Vss RFU RFU...
