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Preliminary THGBM4G6D2HBAIR
8GB THGBM4G6D2HBAIR
TOSHIBA e-MMC Module
INTRODUCTION
THGBM4G6D2HBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module. THGBM4G6D2HBAIR has an industry standard MMC protocol for easy use.
FEATURES THGBM4G6D2HBAIR Interface
THGBM4G6D2HBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Ball / Signal Allocation
P-VFBGA153-1113-0.50-002FP(A) (11.5 x 13mm, H1.0mm max.
THGBM4G6D2HBAIR Datasheet
