THGBM5G6A2JBAIR Datasheet | Toshiba

Preliminary THGBM5G6A2JBAIR 8GB THGBM5G6A2JBAIR INTRODUCTION TOSHIBA e-MMC Module THGBM5G6A2JBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G6A2JBAIR has an industry standard MMC protocol for easy use. Features THGBM5G6A2JBAIR Interface THGBM5G6A2JBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported. - 200MHz SDR / Sanitize / Discard / Packed mand 8/ Power off notification / Large sector size Pin Connection P-VFBGA153-1113-0.50-002 (11.5 x 13mm, H1.0mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC NC NC NC RFU RFU RFU Vss Vcc RFU NC NC RFU NC NC NC Vcc NC NC NC NC NC NC RFU Top View Vss NC NC NC RFU NC NC Vss NC NC RFU RFU DAT7 Vcc Q Vcc CLK NC Vss Q DAT2 DAT6...