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Preliminary THGBM5G6A2JBAIR
8GB THGBM5G6A2JBAIR INTRODUCTION
TOSHIBA e-MMC Module
THGBM5G6A2JBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G6A2JBAIR has an industry standard MMC protocol for easy use.
FEATURES
THGBM5G6A2JBAIR Interface
THGBM5G6A2JBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported. - 200MHz SDR / Sanitize / Discard / Packed command 8/ Power off notification / Large sector size
Pin Connection
P-VFBGA153-1113-0.50-002 (11.5 x 13mm, H1.0mm max.
THGBM5G6A2JBAIR Datasheet
