THGBMBG5D1KBAIL datasheet by Toshiba.
| Part number | THGBMBG5D1KBAIL |
|---|---|
| Datasheet | THGBMBG5D1KBAIL-Toshiba.pdf |
| File Size | 1.02 MB |
| Manufacturer | Toshiba |
| Description | 4GB density e-MMC |
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THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use.
| Part Number | Description |
|---|---|
| THGBM4G5D1HBAIR | 4GB e-MMC Module |
| THGBM4G6D2HBAIR | 8GB e-MMC Module |
| THGBM4G7D2GBAIE | 16GB e-MMC Module |
| THGBM5G5A1JBAIR | 4GB e-MMC Module |
| THGBM5G6A2JBAIR | 8GB e-MMC |
| THGBMDG5D1LBAIL | e-MMC Module |
| THGBMHG7C1LBAIL | 16GB density of e-MMC Module |
