Click to expand full text
THGBM4G7D2GBAIE
16GB THGBM4G7D2GBAIE INTRODUCTION
TOSHIBA e-MMC Module
THGBM4G7D2GBAIE is 16-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM4G7D2GBAIE has an industry standard MMC protocol for easy use.
FEATURES
THGBM4G7D2GBAIE Interface
THGBM4G7D2GBAIE has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Pin Connection
P-TFBGA169-1216-0.50A4 (12 x 16mm, H1.2mm max.
THGBM4G7D2GBAIE Datasheet
