THGBM4G7D2GBAIE Description
This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM4G7D2GBAIE has an industry standard MMC protocol for easy use.
THGBM4G7D2GBAIE Key Features
- Part Numbers
- 25°C to +85°C, and 0%RH to 95%RH non-condensing
- 40°C to +85°C, and 0%RH to 95%RH non-condensing