THGBM4G7D2GBAIE Datasheet | Toshiba

16GB THGBM4G7D2GBAIE INTRODUCTION TOSHIBA e-MMC Module THGBM4G7D2GBAIE is 16-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM4G7D2GBAIE has an industry standard MMC protocol for easy use. Features THGBM4G7D2GBAIE Interface THGBM4G7D2GBAIE has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Pin Connection P-TFBGA169-1216-0.50A4 (12 x 16mm, H1.2mm max. package) 14 13 NC 12 11 NC 10 9 NC 8 7 6 NC 5 4 NC 3 2 NC 1 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC RFU RFU RFU Vss Vcc RFU NC NC RFU NC NC NC Vcc NC NC NC NC NC NC RFU NC NC Vss Top View Vss RFU NC NC NC NC NC RFU RFU DAT7 Vcc Q Vcc CLK NC Vss Q DAT2 DAT6 RFU RFU Vcc Vss RFU RFU...