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THGBMHG7C1LBAIL
16GB THGBMHG7C1LBAIL INTRODUCTION
TOSHIBA e-MMC Module
THGBMHG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG7C1LBAIL has an industry standard MMC protocol for easy use.
FEATURES THGBMHG7C1LBAIL Interface
THGBMHG7C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection
P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max.
THGBMHG7C1LBAIL Datasheet
