THGBMHG7C1LBAIL
THGBMHG7C1LBAIL is 16GB density of e-MMC Module manufactured by Toshiba.
16GB THGBMHG7C1LBAIL INTRODUCTION
TOSHIBA e-MMC Module
THGBMHG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG7C1LBAIL has an industry standard MMC protocol for easy use.
Features
THGBMHG7C1LBAIL Interface
THGBMHG7C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection
P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package)
14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
11 NC NC NC
NC NC NC
NC NC NC
VSF VSF RFU Vss Vcc RFU
NC NC RFU
NC NC NC
Vcc NC NC NC
NC NC NC
Vss NC NC NC
Top View
RFU NC NC
Vss
NC NC RFU
Vss DAT7 Vcc Q
Vcc
CLK NC Vss Q
DAT2 DAT6 NC
RFU Vcc Vss DS Vss RST_n
CMD Vss Q Vcc...
