THGBMHG7C1LBAIL Datasheet 16GB density of e-MMC Module

Manufacturer: Toshiba

Overview: THGBMHG7C1LBAIL 16GB THGBMHG7C1LBAIL INTRODUCTION TOSHIBA e-MMC Module THGBMHG7C1LBAIL is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG7C1LBAIL has an industry standard MMC protocol for easy use.

📥 Download Datasheet

THGBMHG7C1LBAIL 16gb density of e-mmc module by Toshiba - Datasheet Preview

Datasheet Details

Part number	THGBMHG7C1LBAIL
Manufacturer	Toshiba
File Size	0.99 MB
Description	16GB density of e-MMC Module
Download	THGBMHG7C1LBAIL Download (PDF)

Key Features

THGBMHG7C1LBAIL Interface THGBMHG7C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC VSF VSF RFU Vss Vcc RFU NC NC RFU 9 NC NC NC VSF Vcc NC NC NC 8 NC NC NC RFU Vss NC NC NC Top View 7 RFU NC NC Vss RFU.

More Datasheets from Toshiba

Part Number	Description
THGBM4G5D1HBAIR	4GB e-MMC Module
THGBM4G6D2HBAIR	8GB e-MMC Module
THGBM4G7D2GBAIE	16GB e-MMC Module
THGBM5G5A1JBAIR	4GB e-MMC Module
THGBM5G6A2JBAIR	8GB e-MMC
THGBMBG5D1KBAIL	4GB density e-MMC
THGBMDG5D1LBAIL	e-MMC Module