THGBMHG7C1LBAIL - 16GB density of e-MMC Module

Product Overview

Toshiba

Part number	THGBMHG7C1LBAIL
Manufacturer	Toshiba
File Size	0.99 MB
Description	16GB density of e-MMC Module
Datasheet	THGBMHG7C1LBAIL Datasheet
Additional preview pages of the THGBMHG7C1LBAIL datasheet.

THGBMHG7C1LBAIL Interface THGBMHG7C1LBAIL has the JEDEC/MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC VSF VSF RFU Vss Vcc RFU NC NC RFU 9 NC NC NC VSF Vcc NC NC NC 8 NC NC NC RFU Vss NC NC NC Top View 7 RFU NC NC Vss RFU.

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Published: Jan 28, 2019 |