• Part: W3E32M64S-XSBX
  • Manufacturer: White Electronic
  • Size: 749.96 KB
Download W3E32M64S-XSBX Datasheet PDF
W3E32M64S-XSBX page 2
Page 2
W3E32M64S-XSBX page 3
Page 3

W3E32M64S-XSBX Description

The 256MByte (2Gb) DDR SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing 536,870,912 bits. Each chip is internally configured as a quad-bank DRAM. The 256MB DDR SDRAM uses a double data rate ar chi tec ture to achieve high-speed operation.

W3E32M64S-XSBX Key Features

  • DDR SDRAM rate = 200, 250, 266, 333-- Package
  • 208 Plastic Ball Grid Array (PBGA), 13 x 22mm
  • Can be user organized as 2x32Mx32 or 4x32Mx16
  • Weight: W3E32M64S-XSBX
  • 1.5 grams typical
  • 73% Space Savings vs. FPBGA
  • 43% Space Savings vs TSOP Reduced part count 21% I/O reduction vs TSOP
  • 13% I/O reduction vs FPBGA Reduced trace lengths for lower parasitic capacitance Suitable for hi-reliability

W3E32M64S-XSBX Applications

  • This product is subject to change without notice
  • For 333Mbs operation of Industrial temperature CL =