CSD17327Q5A Overview
The NexFET™ power MOSFET has been designed to minimize losses in power conversion applications. (0.071-mm thick) Cu pad on a 0.06-inch (1.52-mm) thick FR4 PCB. NexFET is a trademark of Texas Instruments.
CSD17327Q5A Key Features
- 2 Ultralow Qg and Qgd
- Low Thermal Resistance
- Avalanche Rated
- Pb Free Terminal Plating
- RoHS pliant
- Halogen Free
- SON 5-mm × 6-mm Plastic Package
CSD17327Q5A Applications
- Point-of-Load Synchronous Buck in Networking, Tele and puting Systems
- Optimized for Control FET Applications
- Gate-to- Source Voltage