HI-3200 Datasheet | Specifications & PDF Download

Features  Guard Ring Die Construction for Transient Protection  Low Forward Voltage Drop  Very Low Leakage Current  Highly Stable Oxide Passivated

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NF3000A-RQ2 Series 3 Phase & 3 lines 250VAC Up to 300A/Standard of 3 phase UL1283 (file No.E102708) EN60939-2 (file No.R50031314) Application UPS/I

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WTE POWER SEMICONDUCTORS SR3150 – SR3200 Pb 3.0A HIGH VOLTAGE SURFACE MOUNT SCHOTTKY BARRIER DIODE Features Schottky Barrier Chip Ideally Suited f

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E2V0014-37-X1 ¡ electronic components OL3200N-5 LASER DIODES 1.3 mm High-Power Laser-Diode DIP Module OL3200N-5 GENERAL DESCRIPTION The OL3200N-5 i

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MITSUBISHI MICROCOMPUTERS M32000D3FP SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER DESCRIPTION The M32000D3FP is a new generation microcomputer with a 32-bi

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NF3000C-VQ Series 3 Phase & 3 lines 480VAC Large current up to 150A Application UL1283 (file No.E102708) EN60939-2 (file No.R50031207) Inverter/UP

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NF3000C-VZ Series 3 Phase & 3 lines 500VAC A smallest type for industrial purpose UL1283 (file No.E102708) EN60939-2 (file No.R50031313) Application

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NF3000C-RQ2 Series 3 Phase & 3 lines 500VAC Up to 300A/Standard of 3 phase UL1283 (file No.E102708) EN60939-2 (file No.R50031313) Application UPS/I

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FSA3200 — Two-Port, High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) FSA3200 —Two-Port, High-Speed USB2.0 Switch with Mobile High-Def

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NXP Semiconductors Technical Data Document Number: MC07XS3200 Rev. 6.0, 1/2020 Dual high-side switch (7.0 mOhm) The 07XS3200 is one in a family of S

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ADVANCE INFORMATION Features • 43% smaller than SOT223; 60% smaller than TO252 • Maximum height just 1.1mm • Rated up to 3.2W • VCEO = -200V • IC = -

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CXP83200A CMOS 8-bit Single Chip Microcomputer Description The CXP83200A is a CMOS 8-bit single chip microcomputer of piggyback/evaluator combined typ

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TOSHIBA MOS MEMORY PRODUCT 2M BIT (256K \M)RDX8 BIT) CMOS MASK ROM SILICON GATE CMOS TC532000P DESCRIPTION The TC532000P is a 2,097, 152 bits read

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SMD Schottky Barrier Rectifiers CDBC3150-HF Thru. CDBC3200-HF Reverse Voltage: 150 to 200 Volts Forward Current: 3.0 Amp RoHS Device Halogen Free Fe

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MITSUBISHI MICROCOMPUTERS M32000D4BFP-80 SINGLE-CHIP 32-BIT CMOS MICROCOMPUTER DESCRIPTION The M32000D4BFP-80 is a new generation microcomputer with

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Features • 3.0V to 3.6V Read/Write • Burst Read Performance • • • • • • • • • • w – <100 MHz (RAS Latency = 2, CAS Latency = 6), 10 ns Cycle Time

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NXP Semiconductors Technical Data Document Number: MC07XS3200 Rev. 6.0, 1/2020 Dual high-side switch (7.0 mOhm) The 07XS3200 is one in a family of S

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EV BOLT-DOWN FUSE AEL High Speed Fuse ELECTRICAL SPECIFICATIONS FEATURES:  80 Vdc EV high speed fuse  Rated Current: 30-800 A  Rated Breaking Cap

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October 2016 HI-3200, HI-3201 AVIONICS DATA MANAGEMENT ENGINE / ARINC 429 - CAN BUS BRIDGE GENERAL DESCRIPTION The HI-3200 from Holt Integrated Circ

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Surface Mount Zener Diodes COMCHIP www.comchiptech.com CZRB3110 -CZRB3350 Voltage:110-350 Volts Power: 3.0 Watts Features Low profile package Built

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