AWT6301R Description
The AWT6301R meets the increasing demands for higher efficiency and linearity in CDMA1X handsets. The package pinout was chosen to enable handset manufacturers to switch from a 4mm x 4mm PA module with very few layout changes to the phone board. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-theart reliability, temperature stability, and ruggedness.
AWT6301R Key Features
- InGaP HBT Technology
- High Efficiency: 40%, VMODE = 0 V 41%, VMODE = +2.85 V (no mode switching)
- Low Quiescent Current: 50 mA
- Low Leakage Current in Shutdown Mode: <1 µA
- VREF = +2.85 V (+2.75 V Min Over Temp.)
- Optimized for a 50 Ω System
- Low Profile Surface Mount Package: 1.1mm
- CDMA 1XRTT, 1xEV-DO pliant
- Pinout Enables Easy Phone Board Migration From 4 mm x 4 mm Package
- RoHS pliant Package, 250 oC MSL-3